The thickness of photoresist applied to wafers in semiconductor manufacturing at a particular location on the wafer is uniformly distributed between 0.2037 and 0.2142 micrometers. (a) Determine the proportion of wafers that exceeds 0.2125 micrometers of photoresist thickness. (Round your answer to 3 decir places.) (b) Determine the mean of X. (Round your answer to 4 decimal places.) micrometers (c) Determine the variance of X. (Round your answer to 8 decimal places.) i micrometers²

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The thickness of photoresist applied to wafers in semiconductor manufacturing at a particular location on the wafer is uniformly
distributed between 0.2037 and 0.2142 micrometers.
(a) Determine the proportion of wafers that exceeds 0.2125 micrometers of photoresist thickness. (Round your answer to 3 decimal
places.)
(b) Determine the mean of X. (Round your answer to 4 decimal places.)
micrometers
(c) Determine the variance of X. (Round your answer to 8 decimal places.)
micrometers²
Statistical Tables and Charts
Transcribed Image Text:The thickness of photoresist applied to wafers in semiconductor manufacturing at a particular location on the wafer is uniformly distributed between 0.2037 and 0.2142 micrometers. (a) Determine the proportion of wafers that exceeds 0.2125 micrometers of photoresist thickness. (Round your answer to 3 decimal places.) (b) Determine the mean of X. (Round your answer to 4 decimal places.) micrometers (c) Determine the variance of X. (Round your answer to 8 decimal places.) micrometers² Statistical Tables and Charts
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