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Consider the electronic elements that are cooled by forced convection i in problem 4. The cooling system is designed and tested at sea level (p= 1 atm), but the circuit board is sold to a customer in Mexico City, with an elevation of 2250 m and atmospheric pressure of 76.5 kPa. 2oulay gniwollol adi bap (a) Estimate the surface temperature of the chip located 120 mm from the leading edge of the board when the board is operated in Mexico City. The dependence of various thermophysical properties on pressure is noted in Problem 6.22. (b) It is desirable for the chip operating temperature to be independent of the location of the customer. What air velocity is required for operation in Mexico City if the chip temperature is to be the same as at sea level?

Consider the electronic elements that are cooled by forced convection i in problem 4. The cooling system is designed and tested at sea level (p= 1 atm), but the circuit board is sold to a customer in Mexico City, with an elevation of 2250 m and atmospheric pressure of 76.5 kPa. 2oulay gniwollol adi bap (a) Estimate the surface temperature of the chip located 120 mm from the leading edge of the board when the board is operated in Mexico City. The dependence of various thermophysical properties on pressure is noted in Problem 6.22. (b) It is desirable for the chip operating temperature to be independent of the location of the customer. What air velocity is required for operation in Mexico City if the chip temperature is to be the same as at sea level?

Introduction to Chemical Engineering Thermodynamics
Introduction to Chemical Engineering Thermodynamics
8th Edition
ISBN:9781259696527
Author:J.M. Smith Termodinamica en ingenieria quimica, Hendrick C Van Ness, Michael Abbott, Mark Swihart
Publisher:J.M. Smith Termodinamica en ingenieria quimica, Hendrick C Van Ness, Michael Abbott, Mark Swihart
Chapter1: Introduction
Section: Chapter Questions
Problem 1.1P
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Answer question 5 please!

4. Forced air at T = 25°C and V = 10 m/s is used to cool electronic elements on a circuit board. One such ele- ment is a chip, 4 mm X 4 mm, located 120 mm from the leading edge of the board. Experiments have revealed that flow over the board is disturbed by the elements and that convection heat transfer is correlated by an expression of the form is Nu, = 0.04 Re0.85 P.1/3 V, T 020 uz bug nich kad r1= 4 mm noit Chip Board 3:008W L = 120 mm Estimate the surface temperature of the chip if it is dis- dignol. shanstomed to sipating 30 mW. 5. Consider the electronic elements that are cooled by forced convectioni in problem 4 The cooling system is designed and tested at sea level (p = 1 atm), but the circuit board is sold to a customer in Mexico City, with an elevation of 2250 m and atmospheric pressure of 25ulev gniwollol 76.5 kPa. (a) Estimate the surface temperature of the chip located 120 mm from the leading edge of the board when the board is operated in Mexico City. The dependence of various thermophysical properties on pressure is noted in Problem 6.22. (b) It is desirable for the chip operating temperature to be independent of the location of the customer. What air velocity is required for operation in Mexico City if the chip temperature is to be the same as at sea level? (Note: The dynamic viscosity thermal conductivity
Transcribed Image Text:4. Forced air at T = 25°C and V = 10 m/s is used to cool electronic elements on a circuit board. One such ele- ment is a chip, 4 mm X 4 mm, located 120 mm from the leading edge of the board. Experiments have revealed that flow over the board is disturbed by the elements and that convection heat transfer is correlated by an expression of the form is Nu, = 0.04 Re0.85 P.1/3 V, T 020 uz bug nich kad r1= 4 mm noit Chip Board 3:008W L = 120 mm Estimate the surface temperature of the chip if it is dis- dignol. shanstomed to sipating 30 mW. 5. Consider the electronic elements that are cooled by forced convectioni in problem 4 The cooling system is designed and tested at sea level (p = 1 atm), but the circuit board is sold to a customer in Mexico City, with an elevation of 2250 m and atmospheric pressure of 25ulev gniwollol 76.5 kPa. (a) Estimate the surface temperature of the chip located 120 mm from the leading edge of the board when the board is operated in Mexico City. The dependence of various thermophysical properties on pressure is noted in Problem 6.22. (b) It is desirable for the chip operating temperature to be independent of the location of the customer. What air velocity is required for operation in Mexico City if the chip temperature is to be the same as at sea level? (Note: The dynamic viscosity thermal conductivity
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