a. Consider a 5-m-high, 8-m-long, and 0.20-m-thick wall whose representative cross section is as given in the figure. The thermal conductivities of various materials used, in W/m K, are ka = 2, kB = 8, kc = 15 and kD = 10. Assuming heat transfer through the wall to be one-dimensional, determine the total resistance of the wall using the thermal resistance network analysis. 15 cm 15 cm 10 cm 5 cm 5 cm

a. Consider a 5-m-high, 8-m-long, and 0.20-m-thick wall whose representative cross section is as given in the figure. The thermal conductivities of various materials used, in W/m K, are ka = 2, kB = 8, kc = 15 and kD = 10. Assuming heat transfer through the wall to be one-dimensional, determine the total resistance of the wall using the thermal resistance network analysis. 15 cm 15 cm 10 cm 5 cm 5 cm

Principles of Heat Transfer (Activate Learning with these NEW titles from Engineering!)

8th Edition

ISBN:9781305387102

Author:Kreith, Frank; Manglik, Raj M.

Publisher:Kreith, Frank; Manglik, Raj M.

Chapter4: Numerical Analysis Of Heat Conduction

Section: Chapter Questions

Problem 4.12P

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1.10 A heat flux meter at the outer (cold) wall of a concrete building indicates that the heat loss through a wall of 10-cm thickness is . If a thermocouple at the inner surface of the wall indicates a temperature of 22°C while another at the outer surface shows 6°C, calculate the thermal conductivity of the concrete and compare your result with the value in Appendix 2, Table 11.
1.4 To measure thermal conductivity, two similar 1-cm-thick specimens are placed in the apparatus shown in the accompanying sketch. Electric current is supplied to the guard heater, and a wattmeter shows that the power dissipation is 10 W. Thermocouples attached to the warmer and to the cooler surfaces show temperatures of 322 and 300 K, respectively. Calculate the thermal conductivity of the material at the mean temperature in W/m K. Problem 1.4
A square silicon chip 7mm7mm in size and 0.5-mm thick is mounted on a plastic substrate as shown in the sketch below. The top surface of the chip is cooled by a synthetic liquid flowing over it. Electronic circuits on the bottom of the chip generate heat at a rate of 5 W that must be transferred through the chip. Estimate the steady-state temperature difference between the front and back surfaces of the chip. The thermal conductivity of silicon is 150 W/m K. Problem 1.6
One end of a 0.3-m-long steel rod is connected to a wall at 204C. The other end is connected to a wall that is maintained at 93C. Air is blown across the rod so that a heat transfer coefficient of 17W/m2 K is maintained over the entire surface. If the diameter of the rod is 5 cm and the temperature of the air is 38C, what is the net rate of heat loss to the air?
1.37 Mild steel nails were driven through a solid wood wall consisting of two layers, each 2.5-cm thick, for reinforcement. If the total cross-sectional area of the nails is 0.5% of the wall area, determine the unit thermal conductance of the composite wall and the percent of the total heat flow that passes through the nails when the temperature difference across the wall is 25°C. Neglect contact resistance between the wood layers.
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