6. The heat generated in the circuitry on the surface of a silicon chip is conducted to the ceramic substrate to which it is attached. The chip dissipates 5 W of power. Determine the temperature difference between front and back of the silicon chip if it has thermal conductivity of 130 W/mK. Silicon chip ---6mm Ceramic substrate 5 W 0.5 mm

6. The heat generated in the circuitry on the surface of a silicon chip is conducted to the ceramic substrate to which it is attached. The chip dissipates 5 W of power. Determine the temperature difference between front and back of the silicon chip if it has thermal conductivity of 130 W/mK. Silicon chip ---6mm Ceramic substrate 5 W 0.5 mm

Principles of Heat Transfer (Activate Learning with these NEW titles from Engineering!)

8th Edition

ISBN:9781305387102

Author:Kreith, Frank; Manglik, Raj M.

Publisher:Kreith, Frank; Manglik, Raj M.

Chapter1: Basic Modes Of Heat Transfer

Section: Chapter Questions

Problem 1.73P: Estimate the R-values for a 5-cm-thick fiberglass board and a 2.5-cm-thick polyurethane foam layer....

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